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此款设备是针对PC主板测试(常温、高温、低温),以6/12/16工位进行并测的IC分选机

ModelSUMMIT-3100
Test Site Quantity6/12/16 (Base on Differenet Model)
Temp typeAmbient&High-Temp
UPHMax.2500(12site)
Index TimeMin.4s
Contact ForceMAX.120KG/site
Rotator Function90°,180°,-90°
Test Board Dimension6 site: Max 568mmx500m, 12 site: Max 290mmx500m, 16 site: Max 206mmx500mm
PKG TypeQFN,QFP,BGA,LGA,PLCC,PGA, CSP,TSOP etc
PKG SizeFrom 4x4 to 100x100 mm
Jam Rate<1 /5000
Tray TypeJedec tray
Temp Range25degC to +130degC ±3degC
Temperature accuracy±1degC
Num Of SortingAuto Tray×4
Multi Bin Module (Option: +Multi Bin Module)Auto Tray×2;Fix Tray×15
Tester InterfaceRS-232,Network
Heating Rate (Option: +ATC)Ambient~125℃ < 60s
Cooling Rate (Option: +ATC)125~Ambient< 120s
Heat Dissipation (Option: +ATC)200W@25℃,400W@70℃,450W@125℃(Contact size: 40 x 40mm)
Heating Rate (Option: +Tri-temp)Ambient~125℃ < 15min
Cooling Rate (Option: +Tri-temp)Ambient~-55℃ < 30min
Heat Dissipation (Option: +Tri-temp)150W@-55℃,400W@25℃,400W@125℃(Contact size: 65 x 65mm)
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