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集成电路测试设备制造的领跑者

Test Layout 1/2/4/8 site
Temp type Tri-temp
Pick-up head 2x4 module
UPH Max.6600 (8site)
Index Time Min.1s
Contact Force 240KG 
SOCKET Opening 300mmx135 mm
PKG Type QFN,QFP,BGA,LGA,PLCC,PGA, CSP,TSOP etc.
PKG Size From 2x2 to 70x70 mm
Jam Rate <1/5000
Tray Type Jdec
Temp Range -55degC to +130degC ±3degC
Temperature accuracy  1degC
Heating Method Heater
Heating Rate Ambient~130℃ < 15 min
Cooling Method Refrigerant
Cooling Rate Ambient~-55℃ < 30 min
Heat Dissipation 100W@-55℃,200W@25℃,300W@100℃ 
Num Of Sorting Auto Tray×3,Fix Tray×3
Tester Interface GPIB ,TTL, RS232 ,Network

EXCEED-8808 PnP Handler

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